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• Dongguan factory

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• EMI chamber

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• SMT line

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• SMT Line (Fuji NXT chip shooter)

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• COB equipment - the ideal mold from ASM for encapsulation

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• Wave solder equipment

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• SMT line

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• Production line

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• Testing station

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• XRF for RoHs element measurement

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• Dage X-ray for BGA solder joints inspection

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• AOI for automatic inspection

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• Equipments to measure the solder paste thickness and the viscosity

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• Rework station for BGA

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• Equipment to measure the impedance of the PCB

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• Agilent 3070 ICT

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• Rework station for BGA

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• Teredyne 3D X-ray equipment for the inspection for the solder joints of BGA

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• Thermal cycle equipments

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• Burn-in chamber for reliability testing

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• Thermal shock chamber for reliability test

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• Ultrasonic cleaner for the screen printing

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• AOI, an equipment for inspection

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• Thermal shock equipment for reliability test