PC Partner is dedicated to fulfilling customers' PCBA and component packaging needs with our industry-leading expertise, experience as well as top-notch packaging technologies, which include:

• Surface Mount Technology (SMT)
  
  
• Pin Through Hole (PTH)
  
  
• Bare Die Attach (COB)
  
  
• Ball Grid Array (BGA)
  
  
• Fine Pitch Devices (Flip Chip)
  
  
• Miniature Resistor and Capacitor Array (down to 0201)
  
  
• Automated Connector Attach
  
  
• High Pin Count Press-fit
  
  
• Multiple Chip Module (MCM)
  
  
• Chip Scale Package